Etching technology
Etched: optical glass treated with hydrofluoric acid and RIE
In the clock and semiconductor industry, with MEMS and MOEMS, a wide range of etching processes, such as ‘Bosch’ (DRIE) and ‘LIGA’, has become firmly established. IMT differentiates fundamentally between two methods in glass processing:
Typical bath tub structure with HF
The image shows the characteristic topography of a wet-chemically etched channel. The edges are rounded and the ratio of channel width to channel depth is 2:1.
Wafer level capping for optical sensors
Depending on the application, optical senders and receivers must be hermetically sealed to protect them from environmental influences. In recent years, the TO housing has become firmly established at chip level.
Similar structures can be implemented very effectively at wafer level using etching processes. Wafers structured in this way are then bonded to the optical sensor wafer.
IMT produces 200-mm wafers in line with customer requests, which can then be further processed by the customer. The minimum wafer thickness is 0.3 mm.
