Mission
Sustainability
We take responsibility
IMT takes responsibility for people and the environment in all areas of the business. The way in which we think and act as a company is guided by sustainability. We meet the strictest statutory environmental requirements and ensure compliance with regulations through regular official inspections.
What’s more, we take additional measures which have a sustainable positive effect from both an ecological and economic perspective. For example, by introducing a special heat recovery plant, we have been able to reduce our power consumption by around 30% and heat consumption by around 80%, thereby making a contribution to reducing CO2 emissions.
Memberships
Many connections
IMT is a member of the following specialist associations and organisations:
Milestones
2026
- new MaskAligner
2024
- Automated coater- developer for high-throughput wafer processing
- Automated Optical Inspection (Camtek) for accurate optical inspection of large quantities of wafers
2023
- Update Bonding cluster
- Additional cleaning equipment
2022
- Additional Disco Dicer
- Automated pick-and-inspection equipment for high-throughput wafer processing
- Automated handling for Wafer Bonding
- Automated cleaning station for wafer carriers
2021
- Enlargement of assembly area
- High-End Cleaning line commissioned
- Etching facility for KOH
2019
- RIE system for Chrome
- High-End surface cleaning
2018
- Enlarging production capacity with additional MaskAligner
- Enlargement of production area
- Modernization of office space
2016
- Laser Cutting of Glass.
- Installing one of the first large format laser dicers from industry pioneer Corning /Innolas
- Bonding cluster for Ø200 wafers
- AOI for high-throughput inspection of Ø200mm Wafers
2016
- Installation of bond cluster
- Installation of AOI
- Installation of the second HF etching system – 200-mm wafers
2015
- Installation of SEM – 200-mm wafers
- Installation of the bevelling machine
- Installation of the HF etching system – 200-mm wafers
2014
Final inspection becomes part of the clean room
2012
- Automatic sputtering system – 200-mm wafers
- Installation of the screen mask cleaner – 200-mm wafers
- Installation of the mask aligner – 200-mm wafers
- Installation of the HF etching system – 200-mm wafers
2008
Commissioning of the fifth CNC machine for glass machining
Increase of the share capital to CHF 12 million
2007
Introduction of RIE technology
2002
Opening of the branch office in the USA
2001
Commissioning of the first of three large evaporation systems for optical coatings
1999 – 2000
Complete renovation of the building infrastructure and conversion of production to manufacturing in clean room conditions
1995
Commissioning of the first direct write laser from industry pioneer Heidelberg Instruments for the production of large photomasks and optical calibration plates
1994
Integration into the HEIDENHAIN Group – subsidiary of Dr. Johannes Heidenhain GmbH, Germany
1968
Takeover by Mettler Instrumente AG, Switzerland – now Mettler Toledo
1959
Foundation by Dr E. Rüst under the company name Dr. Rüst AG
