Semiconductor processes consistently implemented

How do you produce cost-effective glass components of a consistently high quality with a high throughput? IMT answered this question at an early stage with the conversion to a 200-mm wafer line. Thanks to a future-oriented investment strategy, we now have equipment from the semiconductor industry along the entire value-added chain.

Our machinery

• Photoresist coating equipment for large formats up to 480 mm x 480 mm
• Laser plotters (DWL, direct write laser) for formats up to 800 mm x 600 mm
• Spin coater (200-mm wafers)
• Mask aligner (200-mm wafers)
• Plasma etching equipment (RIE, 200-mm wafers)
• Automatic HF etching systems (200-mm wafers)
• Wafer saws (200-mm-Wafer)
• Automatic wafer cleaner (200-mm wafers)
• Automatic optical inspection (200-mm wafers)
• SEM with EDX (200-mm wafers)
• Coating systems (PVD and sputtering)
• Interferometer
• Atomic force microscope (AFM)
• Confocal laser microscope