Semiconductor processes consistently implemented
How do you produce cost-effective glass components of a consistently high quality with a high throughput? IMT answered this question at an early stage with the conversion to a 200-mm wafer line. Thanks to a future-oriented investment strategy, we now have equipment from the semiconductor industry along the entire value-added chain.
Our machinery
- Photoresist coating equipment for large formats up to 480 mm x 480 mm
- Laser plotters (DWL, direct write laser) for formats up to 800 mm x 600 mm
- Spin coater (200-mm wafers)
- Mask aligner (200-mm wafers)
- Plasma etching equipment (RIE, 200-mm wafers)
- Automatic HF etching systems (200-mm wafers)
- Wafer saws (200-mm-Wafer)
- Automatic wafer cleaner (200-mm wafers)
- Automatic optical inspection (200-mm wafers)
- SEM with EDX (200-mm wafers)
- Coating systems (PVD and sputtering)
- Interferometer
- Atomic force microscope (AFM)
- Confocal laser microscope
