Machining
The finish: round, square or, if you would prefer, free form
Machining, cleaning and inspection make up the end of the IMT process chain. In this area too, we offer a wide range of technologies and processes. In many applications a precise edge position in relation to the applied microstructure is important. As a result of continuous improvements, we are now able to achieve a level of accuracy from the sawn edge to the structure of < ±15 µm. In addition to numerous CNC machines, we use wafer saws from the semiconductor industry.
Wafer saw
Wafer saws are the default standard for sawing silicon chips within the semiconductor industry. Here at IMT, the same resources are used for the assembly of glass chips.
Substrate: all borosilicate glasses
Substrate thickness: ≥ 0.3 mm
Dimensions: ø ≤ 200 mm
Shape: square, rectangular
Edge breakouts: < 50 µm
Angle of the saw edge: 90° ± 0.5°
Laser Dicing
Laser dicing technology represents the next generation of high-speed, high-precision scribe-and-break processing. An ultra-short pulsed laser creates the high-precision scribe line, while a second laser induces localized thermal stress to propagate the crack along the predefined path. The process removes no material and is completely debris-free and cooland-free, leaving pristine surfaces and superios cut-edge quality.
Substrates: all transparent materials with CTE > 3.0
Substrate thickness: ≥ 0.2 mm
Dimensions: ø ≤ 450 mm
Shape: free form
Edge breakouts: < 50 µm
