Alongside lithography, microstructuring is one of the core processes here at IMT.
We differentiate between two processes depending on the structure to be applied:
Following lithography, the substrate is given a full metallic coating. The underlying resist structures are then wet-chemically opened (lifted). The process can be used on any metals, alloys and multi-coating systems. The lift-off technique is used whenever the properties of the coating rule out etching.
Etching has asserted itself over the lift-off technique in many applications. In etching, the substrate is initially given a full coating and structured with photoresist. The points not covered with photoresist are then opened.
The key advantage lies in the cleanliness of the process. For example, it does not cause particle adhesion, as can be the case in the lift-off process, and the edges are better resolved.