Mikrostrukturierung

Microstructuring

Microstructuring: lift-off or etching technology?

Alongside lithography, microstructuring is one of the core processes here at IMT.
We differentiate between two processes depending on the structure to be applied:

Lift-off process

Lift-off process

Following lithography, the substrate is given a full metallic coating. The underlying resist structures are then wet-chemically opened (lifted). The process can be used on any metals, alloys and multi-coating systems. The lift-off technique is used whenever the properties of the coating rule out etching.

Etching process

Etching process

Etching has asserted itself over the lift-off technique in many applications. In etching, the substrate is initially given a full coating and structured with photoresist. The points not covered with photoresist are then opened.

The key advantage lies in the cleanliness of the process. For example, it does not cause particle adhesion, as can be the case in the lift-off process, and the edges are better resolved.

IMT Masken und Teilungen AG
Privacy Overview
IMT AG Logo

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.

Strictly Necessary Cookies

Strictly Necessary Cookie should be enabled at all times so that we can save your preferences for cookie settings.

3rd Party Cookies

This website uses Google Analytics to collect anonymous information such as the number of visitors to the site, and the most popular pages.

Keeping this cookie enabled helps us to improve our website.